Pak Kee Chan, Software Engineer at Nordic Semiconductor.He gained his Ph.D. in Electronic Engineering from The Chinese University of Hong Kong in 2007. He joined Fujitsu Semiconductor the next year as an Application Engineer on automotive systems. In 2010, Chan moved to DSP Group and worked for two years as a Software Engineer, specializing in DECT protocol stack trouble-shooting. In 2012, he moved to Hong Kong Applied Science and Technology Research Institute. In this job, he performed research and development on Lte Physical Layer, mainly involved in DSP algorithms in downlink / uplink channels. In 2014, Chan joined Nordic Semiconductor as a Field Application Engineer. A year later he joined the customer engineering team as a Software Engineer.
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