Dr. Patrick Ong,Patrick Ong studied physics at the university of Hamburg and received his degree as Diplom Physiker in 2001. In 2001 he joined AMD as a Manufacturing Engineer for Cu CMP. He worked for 5 ½ years for AMD and during that time he was also an assignee for AMD at imec and IBM. In 2006 he joined imec to work on FEOL process development. Currently Patrick Ong is a Senior Process Engineer for CMP at imec, specialized on oxide CMP for STI/FinFet applications, Ge/SiGe CMP and III-V CMP. He has authored 15 publications on CMP and co-authored more than 40 publications. Furthermore, together with a colleague, he has written a book chapter in a recent book about CMP.
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